SK Hynix has announced that its HBM memory production capacity has been completely sold out for this year. The capacity for next year is also almost fully booked. According to the memory manufacturer, this is due to the strong demand for AI products in data centers.
SK Hynix CEO Kwak Noh-Jung discussed the current market situation at a press conference in South Korea, which TrendForce was able to attend. While HBM and high-capacity memory modules are estimated to represent approximately 5 percent of the total memory market revenue in 2023, this share is expected to rise to 61 percent by 2028. HBM is currently mainly deployed in AI accelerators, such as those from Nvidia and AMD.
In addition to SK Hynix, Micron revealed in late March that its 2025 HBM production capacity is almost sold out. However, according to figures from TrendForce, SK Hynix has a significantly larger share of the HBM market. Both SK Hynix and Samsung have an estimated market share of 47 to 49 percent. Micron is in third place with 3 to 5 percent.
The company also announced that it will sample the first HBM3e chips with twelve layers to partners during the course of this month. Mass production should start during the third quarter. In addition, according to the current schedule, SK Hynix will start mass production of HBM4 in the second half of 2028.
